company confidential d r a ft draft d r a ft dr d r a ft d raft d r a ft d r a f draft draft draft draft draft d draft d r a ft d r a ft draft draft draft d ra 1. product profile 1.1 general description the BGA7124 mmic is a one-stage driver amplifier, offered in a low-cost leadless surface-mount package. it delivers 25 dbm output power at 1 db gain compression and a superior performance for various narrowband-tuned application circuits for frequencies up to 2700 mhz. 1.2 features ? 400 mhz to 2700 mhz frequency operating range ? 16 db small signal gain at 2 ghz ? 25 dbm output power at 1 db gain compression ? integrated active biasing ? external matching allows broad application optimization of the electrical performance ? 3.3 v / 5 v single supply operation ? power savings features: ? simple quiescent current adjustment allows class-ab operation ? logic-level shutdown control pin reduces supply current to 4 a ? esd protection at all pins 1.3 applications ? wireless infrastructure (base station, repeater) ? e-metering ? broadband cpe ? satellite master antenna tv (smatv) ? industrial applications ? w-lan / ism / rfid 1.4 quick reference data BGA7124 400 mhz to 2700 mhz 1/4 w high linearity si amplifier rev. 00.07 ? 16 july 2009 objective data sheet table 1. quick reference data z s = z l = 50 , shdn = v i(d)h(shdn) (shutdown disabled). typical values at v cc =5v; t case =25 c, ; unless otherwise specified. symbol parameter conditions min typ max unit i cq adjustable quiescent collector current 5 - 170 ma f frequency [1] 400 - 2700 mhz
d r a ft draft d r a ft dr d r a ft d raft d r a ft d r a f draft draft draft draft draft d draft d r a ft d r a ft draft draft draft d ra BGA7124_1 ? nxp b.v. 2009. all rights reserved. objective data sheet rev. 00.07 ? 16 july 2009 2 of 10 company confidential nxp semiconductors BGA7124 400 mhz to 2700 mhz 1/4 w high linearity si amplifier [1] operation outside this range is possible but parameters are not guaranteed. [2] p o(tone) = 8 dbm; tone spacing = 10 mhz, f 1 = 850 mhz to 1000 mhz; f 2 = 1800 mhz to 2400 mhz; higher imd3 product. [3] applicable to class-a operation; i cq = ma. 2. pinning information 2.1 pinning g p gain power f = 2140 mhz [3] -15- db p l(1db) output power at 1 db gain compression f = 2140 mhz [3] -25- dbm ip3 o output third-order intercept point f = 2140 mhz [2] [3] -38- dbm table 1. quick reference data ?continued z s = z l = 50 , shdn = v i(d)h(shdn) (shutdown disabled). typical values at v cc =5v; t case =25 c, ; unless otherwise specified. symbol parameter conditions min typ max unit transparent top view fig 1. pin configuration sot908-1 1 2 3 4 5 6 7 8 gnd paddle
d r a ft draft d r a ft dr d r a ft d raft d r a ft d r a f draft draft draft draft draft d draft d r a ft d r a ft draft draft draft d ra BGA7124_1 ? nxp b.v. 2009. all rights reserved. objective data sheet rev. 00.07 ? 16 july 2009 3 of 10 company confidential nxp semiconductors BGA7124 400 mhz to 2700 mhz 1/4 w high linearity si amplifier 2.2 pin description [1] this pin is dc-coupled and requires an external dc-blocking capacitor. [2] rf decoupled. [3] the center metal base of the sot908-1 also functions as heatsink for the power amplifier. 3. ordering information 4. functional diagram table 2. pin description symbol pin description n.c. 1, 4 not connected rf_out/v cc 2, 3 rf output for the power amplifier and dc supply input for the rf transistor collector [1] v cc(bias) 5 bias supply voltage [2] shdn 6 shutdown control function enabled / disabled rf_in 7 rf input for the power amplifier [1] icq_adj 8 i cq quiescent collector current adjustment by an external resistor gnd gnd paddle rf ground and dc ground [3] table 3. ordering information type number package name description version BGA7124 hvson8 plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 3 0.85 mm sot908-1 fig 2. functional diagram v cc(bias) icq_adj shdn rf_out / v cc rf_in gnd v / i converter bandgap bias enable
d r a ft draft d r a ft dr d r a ft d raft d r a ft d r a f draft draft draft draft draft d draft d r a ft d r a ft draft draft draft d ra BGA7124_1 ? nxp b.v. 2009. all rights reserved. objective data sheet rev. 00.07 ? 16 july 2009 4 of 10 company confidential nxp semiconductors BGA7124 400 mhz to 2700 mhz 1/4 w high linearity si amplifier 5. shutdown control 6. limiting values 7. thermal characteristics 8. static characteristics [1] defined across v cc = 3.0 v to 3.6 v and 4.8 v to 5.2 v; t case = ? 40 c to +85 c. table 4. shutdown control mode mode description function description shdn unit idle medium power mmic fully off; minimal supply current shutdown control enabled 0 digital logic tx medium power mmic transmit mode shutdown control enabled 1 digital logic table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage - 5.2 v i cc supply current v cc = 5.2 v - ma p i(rf) rf input power - dbm p tot total power dissipation - w t case case temperature ? 40 +85 c t j junction temperature - 150 c table 6. thermal characteristics symbol parameter conditions typ max unit r th(j-case) thermal resistance from junction to case t case =85 c; v cc =5v; i cc =85ma 25 30 k/w table 7. characteristics z s = z l = 50 , shdn = v i(d)h(shdn) (shutdown disabled). typical values at v cc = 3.3 v / 5 v; t case =25 c, ; unless otherwise specified. symbol parameter conditions min typ max unit v cc supply voltage range for v cc = v (typ) 3.0 3.3 3.6 v range for v cc = v (typ) 4.8 5.0 5.2 v i cq adjustable quiescent collector current 5 - 170 ma i cc supply current v cc = 5.2v --ma i cc(shdn) shutdown supply current shdn = v i(d)l(shdn) ; [1] 24 a v i(d)l(shdn) shutdown logic low digital input voltage 0 - 1.5 v v i(d)h(shdn) shutdown logic high digital input voltage 2.5 - v cc v i i(d)l(shdn) shutdown logic low digital input current shdn = v i(d)l(shdn) [1] --1 a i i(d)h(shdn) shutdown logic high digital input current shdn = v i(d)h(shdn) [1] --1 a
d r a ft draft d r a ft dr d r a ft d raft d r a ft d r a f draft draft draft draft draft d draft d r a ft d r a ft draft draft draft d ra BGA7124_1 ? nxp b.v. 2009. all rights reserved. objective data sheet rev. 00.07 ? 16 july 2009 5 of 10 company confidential nxp semiconductors BGA7124 400 mhz to 2700 mhz 1/4 w high linearity si amplifier 9. dynamic characteristics [1] operation outside this range is possible but parameters are not guaranteed. [2] applicable to class-a operation; i cq = 175 ma. [3] p o(tone) = 8 dbm; tone spacing = 10 mhz, f 1 = 840 mhz to 960 mhz; f 2 = 1900 mhz to 2200 mhz; higher imd3 product. [4] defined at p in = ? 40 dbm; small signal conditions. table 8. characteristics at v cc = 5 v z s = z l = 50 , shdn = v i(d)h(shdn) (shutdown disabled). typical values at v cc =5v; t case =25 c, nxp application circuit; unless otherwise specified. symbol parameter conditions min typ max unit f frequency [1] 400 - 2700 mhz g p gain power f = 900 mhz [2] -23 - db f = 1900 mhz [2] -16 - db f = 2140 mhz [2] -15 - db f = 2450 mhz [2] -- db p l(1db) output power at 1 db gain compression f = 900 mhz [2] -25 - dbm f = 1900 mhz [2] -25 - dbm f = 2140 mhz [2] -25 - dbm f = 2450 mhz [2] -- db ip3 o output third-order intercept point f = 900 mhz [2] [3] -38 - dbm f = 1900 mhz [2] [3] -38 - dbm f = 2140 mhz [2] [3] -38 - dbm f = 2450 mhz [2] [3] -- db nf noise figure f = 900 mhz [2] [4] -4.5- db f = 1900 mhz [2] [4] -5.5- db f = 2140 mhz [2] [4] -6.5- db f = 2450 mhz [2] [4] -- db rl in input return loss f = 900 mhz [2] - ? 12.0 - db f = 1900 mhz [2] - ? 10.0 - db f = 2140 mhz [2] - ? 11.0 - db f = 2450 mhz [2] -- db rl out output return loss f = 900 mhz [2] - ? 8.0 - db f = 1900 mhz [2] - ? 14.0 - db f = 2140 mhz [2] - ? 13.0 - db f = 2450 mhz [2] -- db i cc supply current v cc = 5 v [2] - 175 - ma
d r a ft draft d r a ft dr d r a ft d raft d r a ft d r a f draft draft draft draft draft d draft d r a ft d r a ft draft draft draft d ra BGA7124_1 ? nxp b.v. 2009. all rights reserved. objective data sheet rev. 00.07 ? 16 july 2009 6 of 10 company confidential nxp semiconductors BGA7124 400 mhz to 2700 mhz 1/4 w high linearity si amplifier [1] operation outside this range is possible but parameters are not guaranteed. [2] defined across v cc = 3.0 v to 3.6 v; t case = ? 40 c to +85 c. [3] applicable to class-a operation; i cq = 175 ma. [4] p o(tone) = 8 dbm; tone spacing = 10 mhz, f 1 = 850 mhz to 1000 mhz; f 2 = 1800 mhz to 2400 mhz; higher imd3 product. [5] defined at p in = ? 40 dbm; small signal conditions. 10. reliability information table 9. characteristics at v cc = 3.3 v z s = z l = 50 , shdn = v i(d)h(shdn) (shutdown disabled). typical values at v cc =3.3v; t case =25 c, nxp application circuit; unless otherwise specified. symbol parameter conditions min typ max unit f frequency [1] 400 - 2700 mhz g p gain power f = 900 mhz [2] [3] -- db f = 1900 mhz [2] [3] -16 - db f = 2140 mhz [2] [3] -- db f = 2450 mhz [2] [3] -- db p l(1db) output power at 1 db gain compression f = 900 mhz [2] [3] -- dbm f = 1900 mhz [2] [3] -23 - dbm f = 2140 mhz [2] [3] -- dbm f = 2450 mhz [2] [3] -- db ip3 o output third-order intercept point f = 900 mhz [2] [3] [4] -- dbm f = 1900 mhz [2] [3] [4] -36 - dbm f = 2140 mhz [2] [3] [4] -- dbm f = 2450 mhz [2] [3] [4] -- db nf noise figure f = 900 mhz [2] [3] [5] -- db f = 1900 mhz [2] [3] [5] -4.7- db f = 2140 mhz [2] [3] [5] -- db f = 2450 mhz [2] [3] [5] -- db rl in input return loss f = 900 mhz [3] -- db f = 1900 mhz [3] -- db f = 2140 mhz [3] -- db f = 2450 mhz [3] -- db rl out output return loss f = 900 mhz [3] -- db f = 1900 mhz [3] -- db f = 2140 mhz [3] -- db f = 2450 mhz [3] -- db i cc supply current v cc = 3.3 v [2] [3] - 175 - ma table 10. reliability life test conditions intrinsic failure rate htol confidence level 60 %; t j =55 c; activation energy = 0.7 ev; acceleration factor determined by arrhenius xx
d r a ft draft d r a ft dr d r a ft d raft d r a ft d r a f draft draft draft draft draft d draft d r a ft d r a ft draft draft draft d ra BGA7124_1 ? nxp b.v. 2009. all rights reserved. objective data sheet rev. 00.07 ? 16 july 2009 7 of 10 company confidential nxp semiconductors BGA7124 400 mhz to 2700 mhz 1/4 w high linearity si amplifier 11. package outline fig 3. package outline sot908-1 (hvson8) 0.5 0.2 1 0.05 0.00 a 1 e h b unit d (1) y e 1.5 e 1 references outline version european projection issue date iec jedec jeita mm 3.1 2.9 cd h 1.65 1.35 y 1 3.1 2.9 2.25 1.95 0.3 0.2 0.05 0.1 dimensions (mm are the original dimensions) sot908-1 mo-229 e (1) 0.5 0.3 l 0.1 v 0.05 w sot908-1 hvson8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm a (1) max. 05-09-26 05-10-05 note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. x terminal 1 index area b a d e detail x a a 1 c c y c y 1 exposed tie bar (4 ) exposed tie bar (4 ) b terminal 1 index area e 1 e a c b v m c w m e h d h l 14 5 8 0 1 2 mm scale
d r a ft draft d r a ft dr d r a ft d raft d r a ft d r a f draft draft draft draft draft d draft d r a ft d r a ft draft draft draft d ra BGA7124_1 ? nxp b.v. 2009. all rights reserved. objective data sheet rev. 00.07 ? 16 july 2009 8 of 10 company confidential nxp semiconductors BGA7124 400 mhz to 2700 mhz 1/4 w high linearity si amplifier 12. abbreviations 13. revision history table 11. abbreviations acronym description cpe customer-premises equipment esd electrostatic discharge htol high temperature operating life ism industrial, scientific and medical mmic monolithic microwave integrated circuit rfid radio frequency identification tx transmit w-lan wideband code division multiple access table 12. revision history document id release date data sheet status change notice supersedes BGA7124_1 objective data sheet - -
d r a ft draft d r a ft dr d r a ft d raft d r a ft d r a f draft draft draft draft draft d draft d r a ft d r a ft draft draft draft d ra BGA7124_1 ? nxp b.v. 2009. all rights reserved. objective data sheet rev. 00.07 ? 16 july 2009 9 of 10 company confidential nxp semiconductors BGA7124 400 mhz to 2700 mhz 1/4 w high linearity si amplifier 14. legal information 14.1 data sheet status [1] please consult the most recently issued docum ent before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest product status information is available on the internet at url http://www.nxp.com . 14.2 definitions draft ? the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 14.3 disclaimers general ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale ? nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 15. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objective specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
d r a ft draft d r a ft dr d r a ft d raft d r a ft d r a f draft draft draft draft draft d draft d r a ft d r a ft draft draft draft d ra company confidential nxp semiconductors BGA7124 400 mhz to 2700 mhz 1/4 w high linearity si amplifier ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 16 july 2009 document identifier: BGA7124_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 16. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 shutdown control . . . . . . . . . . . . . . . . . . . . . . . 4 6 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 thermal characteristics . . . . . . . . . . . . . . . . . . 4 8 static characteristics. . . . . . . . . . . . . . . . . . . . . 4 9 dynamic characteristics . . . . . . . . . . . . . . . . . . 5 10 reliability information . . . . . . . . . . . . . . . . . . . . 6 11 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 14.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 14.2 definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 14.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 14.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 15 contact information. . . . . . . . . . . . . . . . . . . . . . 9 16 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
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